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1

Assessment of Joule Heating and Temperature Distribution on Printed Circuit Boards Via Electrothermal Simulations

Baris Dogruoz, M.

Journal:

Journal of Electronic Packaging

Year:

2016

Language:

english

File:

PDF, 2.67 MB

english, 2016

2

Experiments and modeling of the hydraulic resistance and heat transfer of in-line square pin fin heat sinks with top by-pass flow

M. Baris Dogruoz, Mario Urdaneta, Alfonso Ortega

Journal:

International Journal of Heat and Mass Transfer

Year:

2005

Language:

english

File:

PDF, 761 KB

english, 2005

3

Evolution of Microdroplet Morphology Confined on Asymmetric Micropillar Structures

Ma, Binjian, Shan, Li, Dogruoz, M. Baris, Agonafer, Damena

Journal:

Year:

2019

Language:

english

File:

PDF, 23.73 MB

english, 2019

4

A Model for Flow Bypass and Tip Leakage in Pin Fin Heat Sinks

Dogruoz, M. Baris, Ortega, Alfonso, Westphal, Russell V.

Journal:

Journal of Electronic Packaging

Year:

2006

Language:

english

File:

PDF, 927 KB

english, 2006

5

Computations with the multiple reference frame technique: Flow and temperature fields downstream of an axial fan

Dogruoz, M. Baris, Shankaran, Gokul

Journal:

Numerical Heat Transfer, Part A: Applications

Year:

2017

Language:

english

File:

PDF, 1.69 MB

english, 2017

6

[ASME ASME 2002 International Mechanical Engineering Congress and Exposition - New Orleans, Louisiana, USA (November 17–22, 2002)] Heat Transfer, Volume 7 - Experiments and Modeling of the Heat Transfer of In-Line Square Pin Fin Heat Sinks With Top By-Pass Flow

Dogruoz, M. Baris, Urdaneta, Mario, Ortega, Alfonso

Year:

2002

Language:

english

File:

PDF, 299 KB

english, 2002

7

Spatial Variation of Temperature on Printed Circuit Boards: Effects of Anisotropic Thermal Conductivity and Joule Heating

Dogruoz, Mehmet Baris, Shankaran, Gokul

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2012

Language:

english

File:

PDF, 1.51 MB

english, 2012

8

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Validation of an advanced fan model with multiple reference frame approach

Shankaran, Gokul V., Dogruoz, M. Baris

Year:

2010

Language:

english

File:

PDF, 2.28 MB

english, 2010

9

Investigation of the evaporation heat transfer mechanism of a non-axisymmetric droplet confined on a heated micropillar structure

Shan, Li, Ma, Binjian, Li, Junhui, Dogruoz, Baris, Agonafer, Damena

Journal:

International Journal of Heat and Mass Transfer

Year:

2019

Language:

english

File:

PDF, 3.47 MB

english, 2019

10

[IEEE 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM) - Orlando, FL, USA (2008.05.28-2008.05.31)] 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - An investigation on the conduction and convection heat transfer from advanced heat sinks

Dogruoz, M. Baris, Arik, Mehmet

Year:

2008

Language:

english

File:

PDF, 150 KB

english, 2008

11

Effects of Trace Layers and Joule Heating on the Temperature Distribution of Printed Circuit Boards: A Computational Study

Dogruoz, M. Baris, Nagulapally, Manoj K.

Journal:

Journal of Thermal Science and Engineering Applications

Year:

2009

Language:

english

File:

PDF, 1.06 MB

english, 2009

12

Augmenting Heat Transfer from Fail-Safe Magneto-Rheological Fluid Dampers Using Fins

Dogruoz, M. Baris, Wang, Eric L., Gordaninejad, Faramarz, Stipanovic, Arthur J.

Journal:

Journal of Intelligent Material Systems and Structures

Year:

2003

Language:

english

File:

PDF, 220 KB

english, 2003

13

SPIE Proceedings [SPIE SPIE's 7th Annual International Symposium on Smart Structures and Materials - Newport Beach, CA (Monday 6 March 2000)] Smart Structures and Materials 2000: Smart Systems for Bridges, Structures, and Highways - Heat transfer from magneto-rheological fluid dampers

Dogruoz, M. Baris, Gordaninejad, Faramarz, Wang, Eric L., Stipanovich, Arthur J., Liu, S.-C.

Year:

2000

Language:

english

File:

PDF, 375 KB

english, 2000

14

[ASME ASME 2003 International Mechanical Engineering Congress and Exposition - Washington, DC, USA (November 15–21, 2003)] Heat Transfer, Volume 4 - A Numerical Study of Turbulent Heat Transfer in Unconfined Impinging Slot Jets

Dogruoz, M. Baris, Orgega, Alfonso

Year:

2003

Language:

english

File:

PDF, 775 KB

english, 2003

15

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Orthotropic thermal conductivity and Joule heating effects on the temperature distribution of printed circuit boards

Shankaran, Gokul V., Dogruoz, M. Baris, deAraujo, Daniel

Year:

2010

Language:

english

File:

PDF, 1.76 MB

english, 2010

16

[ASME ASME 2011 International Mechanical Engineering Congress and Exposition - Denver, Colorado, USA (November 11–17, 2011)] Volume 6: Fluids and Thermal Systems; Advances for Process Industries, Parts A and B - Accurate Prediction of Transient Thermal Behavior of Electronic Systems With State-Space Models

Dogruoz, M. Baris, Magargle, Ryan, Shankaran, Gokul

Year:

2011

Language:

english

File:

PDF, 1.06 MB

english, 2011

17

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Heat transfer in microchannels: substrate effects and cooling efficiency for rectangular and circular ducts

Dogruoz, M. Baris, Arik, Mehmet, Pautsch, Adam

Year:

2010

Language:

english

File:

PDF, 844 KB

english, 2010

18

[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 1: Thermal Management - An Investigation Into Performance Characteristics of an Axial Flow Fan Using CFD for Electronic Devices

Hashim, Hafiz M., Dogruoz, Baris, Arik, Mehmet, Parlak, Murat

Year:

2015

Language:

english

File:

PDF, 2.94 MB

english, 2015

19

[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Transient thermal behavior of SOIC packages — an optimization study

Dogruoz, M. Baris, Abarhama, Mehdi, Shankaranb, Gokul V.

Year:

2016

Language:

english

File:

PDF, 1.61 MB

english, 2016

20

[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - An Investigation of Performance of Synthetic Jets Emanating from Circular, Elliptical and Rectangular Nozzles

Isil, Onuralp, Baris Dogruoz, M., Arik, Mehmet

Year:

2018

Language:

english

File:

PDF, 1.02 MB

english, 2018

21

[ASME ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems - Portland, Oregon, USA (July 6–8, 2011)] ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2 - Advances in Fan Modeling: Using Multiple Reference Frame (MRF) Approach on Blowers

Shankaran, Gokul, Dogruoz, M. Baris

Year:

2011

Language:

english

File:

PDF, 1.55 MB

english, 2011

22

[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays - A Computational Study on the Momentum and Heat Transfer Distribution of a Low Frequency Round Impinging Synthetic Jet

Ikhlaq, Muhammad, Dogruoz, Baris, Ghaffari, Omidreza, Arik, Mehmet

Year:

2015

Language:

english

File:

PDF, 3.44 MB

english, 2015

23

[ASME ASME 2012 International Mechanical Engineering Congress and Exposition - Houston, Texas, USA (Friday 9 November 2012)] Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D - Advances in Fan Modeling: Issues and Effects on Thermal Design of Electronics

Dogruoz, M. Baris, Shankaran, Gokul

Year:

2012

Language:

english

File:

PDF, 1.47 MB

english, 2012

24

Experimental Investigation of Evaporation from Asymmetric Microdroplets Confined on Heated Micropillar Structures

Shan, Li, Li, Junhui, Ma, Binjian, Jiang, Xinyu, Dogruoz, Baris, Agonafer, Damena

Journal:

Experimental Thermal and Fluid Science

Year:

2019

Language:

english

File:

PDF, 6.18 MB

english, 2019

25

[IEEE 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2020.7.21-2020.7.23)] 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Enhanced Thermal Performance of High Flux LED Systems with Two-Phase Immersion Cooling

Cengiz, Ceren, Muslu, Ahmet Mete, Arik, Mehmet, Dogruoz, Baris

Year:

2020

File:

PDF, 1.61 MB

2020

26

[ASME ASME 2011 International Mechanical Engineering Congress and Exposition - Denver, Colorado, USA (November 11–17, 2011)] Volume 6: Fluids and Thermal Systems; Advances for Process Industries, Parts A and B - Computational Modeling of Anisotropic Thermal Conductivity and Joule Heating on Printed Circuit Boards

Dogruoz, M. Baris, Shankaran, Gokul, Pitner, Gregory, Nagulapally, Manoj

Year:

2011

Language:

english

File:

PDF, 2.23 MB

english, 2011

27

[ASME ASME 2013 Heat Transfer Summer Conference collocated with the ASME 2013 7th International Conference on Energy Sustainability and the ASME 2013 11th International Conference on Fuel Cell Science, Engineering and Technology - Minneapolis, Minnesota, USA (Sunday 14 July 2013)] Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles - A Numerical Study of a Single Unsteady Laminar Slot Jet in a Confined Structure

Ghaffari, Omidreza, Dogruoz, M. Baris, Arik, Mehmet

Year:

2013

Language:

english

File:

PDF, 2.12 MB

english, 2013

28

[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Sensitivity analysis in conjugate heat transfer for electronics cooling

Dogruoz, M. Baris, Sathyamurthy, Prabhu, Mathur, Sanjay

Year:

2012

Language:

english

File:

PDF, 1.26 MB

english, 2012

29

SPIE Proceedings [SPIE SPIE's 8th Annual International Symposium on Smart Structures and Materials - Newport Beach, CA (Sunday 4 March 2001)] Smart Structures and Materials 2001: Damping and Isolation - Heat transfer from fail-safe magnetorheological fluid dampers

Dogruoz, M. Baris, Gordaninejad, Faramarz, Wang, Eric L., Stipanovich, Arthur J., Inman, Daniel J.

Year:

2001

Language:

english

File:

PDF, 666 KB

english, 2001

30

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Using state-space models for accurate computations of transient thermal behavior of electronic packages

Shankaran, Gokul V., Dogruoz, M. Baris, Magargle, Ryan

Year:

2014

Language:

english

File:

PDF, 819 KB

english, 2014

31

Measurements of skin friction and heat transfer beneath an impinging slot jet

Dogruoz, M. Baris, Ortega, Alfonso, Westphal, Russell V.

Journal:

Experimental Thermal and Fluid Science

Year:

2015

Language:

english

File:

PDF, 1.43 MB

english, 2015

32

[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - Direct Liquid Cooling of High Flux LED Systems: Hot Spot Abatement

Tamdogan, Enes, Arik, Mehmet, Dogruoz, M. Baris

Year:

2013

Language:

english

File:

PDF, 1.44 MB

english, 2013

33

[IEEE 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Molecular Dynamic Simulation of the Effect of Nanocoating on Two-Phase Evaporative Heat and Mass Transfer

Ma, Binjian, Shan, Li, Li, Junhui, Dogruoz, Baris, Agonafer, Damena

Year:

2019

Language:

english

File:

PDF, 4.19 MB

english, 2019

34

[ASME ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - San Francisco, California, USA (Monday 27 August 2018)] ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Numerical Investigation of Shape Effect on Microdroplet Evaporation

Shuai, Shuai, Du, Zichen, Ma, Binjian, Shan, Li, Dogruoz, Baris, Agonafer, Damena

Year:

2018

Language:

english

File:

PDF, 3.19 MB

english, 2018

35

[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Investigation of power distribution on an axial fan

Hashim, Hafiz M., Yasa, Yusuf, Dogruoz, M. Baris, Arik, Mehmet, Mese, Erkan

Year:

2016

Language:

english

File:

PDF, 1.03 MB

english, 2016

36

[IEEE 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL (2017.5.30-2017.6.2)] 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - An experimental and computational investigation of a thin piezofan cooler

Dogruoz, M. Baris, Arik, Mehmet, Parsa, Shadi

Year:

2017

File:

PDF, 892 KB

2017

37

Utility of Cervical Cannulation During Difficult Resternotomy in Congenital Heart Surgery

Temur, Bahar, Davutoglu, Arda, Dogruoz, Alper, Aydin, Selim, Suzan, Dilek, Kırat, Barış, Odemis, Ender, Erek, Ersin

Journal:

World Journal for Pediatric and Congenital Heart Surgery

Year:

2020

File:

PDF, 354 KB

2020

38

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - An investigation into momentum and temperature fields of a meso-scale synthetic jet

Ghaffari, Omidreza, Dogruoz, M. Baris, Arik, Mehmet

Year:

2014

Language:

english

File:

PDF, 1.15 MB

english, 2014

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